ViaLite has introduced a new fan assembly option for its 3U rack chassis.
Housing 12 small fans, the assembly lowers the operating temperature of the chassis and its inserted chassis cards by increasing air circulation. This new feature is especially beneficial for chassis units located in higher ambient temperatures, whether housed in an equipment room rack system or outdoor enclosure.
The assembly also allows chassis units to be fully populated with DWDM cards, up to six transmit cards and six receive cards, when the chassis is located in a typical equipment room. This is ideal for larger teleports as they transition to high throughput satellites (HTS) with higher bandwidths, requiring RF over fiber links with greater dynamic range.
Additionally, the fan assembly can increase product lifetime of both the chassis and its cards by improving the Mean Time Between Failure (MTBF) which directly correlates to lower operating temperatures.
Upon testing a fully populated 3U chassis with six receiver cards and seven standard transmitter cards, and a fan assembly, within a ViaLite ODE-B3U enclosure, the temperature was reduced by 9 – 10 °C. The temperature drop achieved will vary depending on the number and type of cards used and the enclosure location.
ViaLite Product Manager, Edward Levack, explained: “With the new fan assembly, the 3U Rack Chassis can be installed in outdoor enclosures that are in warmer ambient conditions than previously possible. Equally, with this cooling system, more DWDM links can be installed in the chassis while keeping within the operating temperature envelope. Both of these benefits mean the customer can be more confident in the system and modules installed.”
The fan assembly is powered by the existing 3U power supplies; negating the need for any additional power supplies.
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